Wireless Interface Technologies for 3D IC and Module Integration

ISBN: 9781108841214
Author/Editor: Tadahiro Kuroda

Publisher: Cambridge University Press

Year:

SKU: ABD-CUP-5696 Category:

Description

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

Includes a comprehensive description of how the changing computing requirements and evolving performance constraints in IC design have co-evolved
Provides intuitive explanations of the design principles and trade-offs of near-field wireless interface technologies for 2.5-3D IC and module integration
Presents verified implementation examples for a wide range of popular applications including wideband DRAM, 3D NoC, smartphones, automotive systems, SSD, satellite processor systems, multi-drop memory bus and backplane, and stacked memory for neural networks

Additional information

Weight 1.1 kg

Product Properties

Year of Publication

2021

Table of Contents

n/a

Author

Tadahiro Kuroda

ISBN/ISSN

9781108841214

Binding

Hardback

Publisher

Cambridge University Press

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