Featuring current technology developments, this text examines every aspect of microwave circuit design and fabrication techniques. Topics covered include: circuit board materials, etching, and packaging.
Additional information
Weight
0.5 kg
Product Properties
Year of Publication
2000
Table of Contents
Laminates and substrates; metals; microwave artwork; etching techniques; bonding techniques; micorwave packaging. Appendices: dielectric constants; coefficients of expansion; micorwave laminate data sheets; connector information.Laminates and substrates; metals; microwave artwork; etching techniques; bonding techniques; microwave packaging. Appendices: dielectric constants; coefficients of expansion; microwave laminate data sheets; connector information.
Author
THOMAS
ISBN/ISSN
9781580530644
Binding
n/a
Edition
3
Publisher
Artech House
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