Advances in 3D Integrated Circuits and Systems
Original price was: ₹4,477.60.₹3,582.08Current price is: ₹3,582.08.
ISBN: 9789814699013
Author/Editor: Hao Yu
Publisher: World Scientific
Year: 2015
1 in stock (can be backordered)
Description
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
Additional information
| Weight | 0.56 kg |
|---|
Product Properties
| Year of Publication | 2015 |
|---|---|
| Table of Contents | TSV and TSI Device Fabrication; Device Modeling; Macromodeling; Power and Thermal Integrity; Power Ground Design; Clock-Tree Design; 3D IC Test; Compressive Sensing and Data Recovery; Power and Thermal Modeling; Microfludic Based Thermal Management; Power I/O Management; Signal I/O Bandwidth Management; Q-Learning; Signal I/O Voltage-Swing Management; 3D Sensor Design; CMOS Readout Circuit; I/O Buffer Design; I/O with Clock-Data Recovery; Multi-Core Microprocessor Design; Non-Volatile Memory; |
| Author | Hao Yu |
| ISBN/ISSN | 9789814699013 |
| Binding | Paperback |
| Edition | 1 |
| Publisher | World Scientific |
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